Fast hierarchical aggregation and decomposition (HAD) algorithms for optimal routing in high-speed data networks /

In this research, new distributed algorithms are developed to

Bibliographic Details
Main Author: Zhu, Shan
Format: Thesis Book
Language:English
Published: [Place of publication not identified] : [publisher not identified] ; 1995.
Subjects:
Online Access:http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=742536531&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQD
Description
Summary:In this research, new distributed algorithms are developed to
solve optimal routing problems (ORPS) for large data networks
with multiple commodities. We first discuss our new routing
algorithm, which utilizes our computation localization
scheme, for the networks with general topologies. The
algorithm is shown to be much faster than other existing
algorithms for general network topologies. We then develop
our new hierarchical aggregation/decomposition (HAD) algo
rithms, which can further speedup the computations for
hierarchical network topologies including hierarchically
clustered and hierarchically structured network topologles.
Our algorithms prove to be faster, more scalable than other
existing HAD based algorithms and much easier to implement.
In high-speed networks, such as ATM networks, packets could
be lost while being routed to their destinations.
Minimization of packet loss probabilities becomes a major
concern. The ORP minimizing average network packet loss
probabilities is more complicated since the ORP is a non-
convex problem and the ordinary gradient projection algorithm
cannot be directly used to obtain optimal routing. To solve
the packet loss ORP, we developed an HAD based two-stage
algorithm. The algorithm can effectively avoid the traps of
local minimum caused by the non-convexity of the problem and
thus, can find the true optimal solution of the ORP with
highcomputation speed. The impelementation of our algorithms
are simulated using OPNET simulation tool. OPNET is a
leading networking simulation tool and is developed by MIL3,
Inc. The simulation results are consistent to our
theoretical analyses.
Item Description:Vita.
"Major Subject: Electrical Engineering".
Physical Description:xi, 126 leaves : illustrations ; 28 cm.
Issued also on microfiche from University Microfilms Inc.
Bibliography:Includes bibliographical references.