http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
CAE/CAD application to electronic packaging
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Computer-aided design application to electronic packaging
American Society of Mechanical Engineers
Electrical and Electronic Packaging Division.
International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.
Includes bibliographical references and index.