http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Application of fracture mechanics in electronic packaging and materials
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
American Society of Mechanical Engineers
Electrical and Electronic Packaging Division.
sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu [and others].
Includes bibliographical references and index.