rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Application of fracture mechanics in electronic packaging and materials
    sub title: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
  name:
    name part: International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
    role:
      role term: creator
  name:
    name part: Wu, Tien Y.
  name:
    name part: American Society of Mechanical Engineers
    name part: Electrical and Electronic Packaging Division.
  name:
    name part: American Society of Mechanical Engineers
    name part: Materials Division.
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 1995
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: vi, 271 pages : illustrations ; 28 cm.
  note: sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu [and others].
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  subject:
    topic: Fracture mechanics
    genre: Congresses
  related item:
    title info:
      title: EEP (Series) ; v. 11
  related item:
    title info:
      title: MD (Series) ; v. 64
  identifier: 0791817369
  identifier: 95081270
  record info:
    record content source: GZM
    record creation date: 960318
    record change date: 20151005070348.0
    record identifier: in00001313788