Description
Item Description:"This symposium is a trans-disciplinary forum for exploring the progress made in understanding, analyzing, and modeling thermal transport processes and thermally-induced failures in the fabrication, assembly, and use of semiconductors, data-storage devices, and electronic systems."
"IEEE catalog number 96CH35940"--Title page verso.
Physical Description:xxi, 407 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references.
ISBN:078033325X (softbound)
0780333268 (casebound)