Advanced packaging concepts for digital avionics : Les techniques avancées de mise sous boitier : papers presented at the Avionics Panel Symposium held in San Diego, CA, USA, 6-9 June 1994.
| Corporate Authors: | , |
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| Format: | Microform Book |
| Language: | English |
| Published: |
Neuilly sur Seine, France :
North Atlantic Treaty Organization, Advisory Group for Aerospace Research and Development,
1994.
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| Series: | AGARD conference proceedings ;
no. 562. |
| Subjects: |
| Item Description: | Microform. |
|---|---|
| Physical Description: | 1 volume (various pagings) : illustrations ; 30 cm. |
| Bibliography: | Includes bibliographical references. |