Use of burn-in for enhancing reliability of highly reliable electronic systems /
High reliability is the key to success in this modern market. Important issues in reliability are reviewed in the first chapter and we focus our study on burn-in, a pre-conditioning of assemblies and the accelerated power-on tests performed on equipment subjected to temperature, vibration, voltage,...
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| Format: | Thesis Book |
| Language: | English |
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[Place of publication not identified] :
[publisher not identified] ;
1994.
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| Online Access: | http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=741324721&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQD |
| Summary: | High reliability is the key to success in this modern market. Important issues in reliability are reviewed in the first chapter and we focus our study on burn-in, a pre-conditioning of assemblies and the accelerated power-on tests performed on equipment subjected to temperature, vibration, voltage, and humidity cycling. Burnin techniques are widely applied to integrated circuits (IC) to enhance the reliability observed by the users. After considering the impact of incompatibility, an level burnins and redundancy allocation are performed in Ref. [11] and Chapter 11, from which, the system burn-in is preferred because it can remove many of the residual defects left from component and subsystem burn-in. The complex configuration of a system makes it hard to formulate the time for system failure by a probability distribution. A simple nonparametric approach is introduced to handle this difficulty. Furthermore, the cost of testing a system is high, which results in only limited samples available for new ICs. To overcome these problems, a nonparametric Bayesian approach is applied to determine the system burn-in time by using the Dirichlet distribution and the Dirichlet process. Systems used in random environments are also considered. |
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| Item Description: | Vita. "Major subject: Industrial Engineering". |
| Physical Description: | xii, 131 leaves : illustrations ; 28 cm. |
| Bibliography: | Includes bibliographical references. |