Electrical performance of electronic packaging.

Bibliographic Details
Corporate Authors:	Topical Meeting on Electrical Performance of Electronic Packaging, IEEE Microwave Theory and Techniques Society, IEEE Components, Hybrids, and Manufacturing Technology Society
Format:	Conference Proceeding
Language:	English
Published:	[New York, N.Y.] : Institute of Electrical and Electronics Engineers.
Subjects:	Electronic packaging > Congresses.

Description
Item Description:	Evans description based on: 3rd (1994). Title from cover. Also cited as: Proceedings.
Physical Description:	volumes : illustrations ; 28 cm.
Publication Frequency:	Annual