rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Heat transfer in electronic systems, 1994
    sub title: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
  name:
    name part: Wirtz, R. A.
  name:
    name part: American Society of Mechanical Engineers
    name part: Heat Transfer Division.
  name:
    name part: International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 1994
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: vii, 153 pages : illustrations ; 28 cm.
  note: sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz.
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
    genre: Congresses
  subject:
    topic: Heat
    topic: Transmission
    genre: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Cooling
    topic: Congresses
  classification: TK7870.15 .H42 1994
  classification: 621.381/046
  related item:
    title info:
      title: HTD (Series) ; vol. 292
  identifier: 0791814106
  identifier: 94078980
  record info:
    record content source: MdU
    record creation date: 940915
    record change date: 20151003081953.0
    record identifier: in00001251941