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Heat transfer in electronic systems, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers. Heat Transfer Division
Other Authors: Wirtz, R. A.
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, [1994]
Series:HTD (Series) ; vol. 292.
Subjects:
Electronic packaging > Congresses.
Heat > Transmission > Congresses.
Electronic apparatus and appliances > Cooling > Congresses.
Description
Physical Description:vii, 153 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791814106