http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Mechanics and materials for electronic packaging
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
American Society of Mechanical Engineers
International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
v. 1. Design and process issues in electronic packaging / edited by William T. Chen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
co-sponsored by the Applied Mechanics Division, ASME [and others].
Includes bibliographical references and index.