rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Mechanics and materials for electronic packaging
    sub title: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
  name:
    name part: Chen, William T.
  name:
    name part: Schen, Michael A.
  name:
    name part: Dunn, M. L. (Martin L.)
  name:
    name part: American Society of Mechanical Engineers
    name part: Applied Mechanics Division.
  name:
    name part: International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
  type of resource: text
  genre: bibliography
  genre: conference publication
  origin info:
    place:
      place term: nyu
    date issued: 1994
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: 3 volumes : illustrations ; 28 cm.
  table of contents: v. 1. Design and process issues in electronic packaging / edited by William T. Chen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
  note: co-sponsored by the Applied Mechanics Division, ASME [and others].
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
    genre: Congresses
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  identifier: 0791814491 (v. 1)
  identifier: 0791814270 (v. 2)
  identifier: 0791814424 (v. 3)
  identifier: 94079149
  record info:
    record content source: UMC
    record creation date: 950109
    record change date: 20151003072544.0
    record identifier: in00001242072