Eleventh annual IEEE Semiconductor Thermal Measurement and Management Symposium : February 7-9, 1995, Red Lion Hotel, San José, CA, USA.

Bibliographic Details
Corporate Authors:	IEEE Semiconductor Thermal Measurement and Management Symposium San José, Calif., Components, Packaging & Manufacturing Technology Society
Format:	Conference Proceeding Book
Language:	English
Published:	Piscataway, NJ : IEEE Service Center, ©1995.
Subjects:	Semiconductors > Thermal properties > Congresses. Semiconductors > Cooling > Congresses. Semi-conducteurs > Propriétés thermiques > Congrès. Semi-conducteurs > Refroidissement > Congrès. Semiconductors > Cooling Semiconductors > Thermal properties Semiconducteurs > Propriétés thermiques > Congrès. Conference papers and proceedings
Online Access:	IEEE Xplore IEEE Xplore

Table of Contents:

A Novel Approach For The Thermal Characterization of Electronic Parts / Clemens Lasance, Heinz Vinke, Harvey Rosten and Karl-Ludwig Weiner
Thermal Characterization of Vertical Multichip Modules MCM-V / C. Cahill, T. Compagno, J. O. Donovan, O. Slattery, C. O'Mathuna, J. Barrett, I. Drouhin, C. Val, J. P. Tigneres, J. Stern, P. Ivey, M. Masgrangeas and A. Coello-Vera
An Assessment of the Thermal Performance of the PBGA Family / Shailesh Mulgaonker, Ben Chambers and Mali Mahalingham
Enhancement of Convective Cooling of Electronic Circuit Components / Cila Herman, Bhalchandra Puranik, Eric Kang and Sandor Szokolai
Effect on Observed Package Thermal Performance of System Board Metal Content / David Billings and Roger Paul Stout
A Study of Chip Thermal Crosstalk in Plastic VLSI Packages / David H. Chien and Chin C. Lee
Influence of Elastic and Plastic Contact Models in the Overall Thermal Resistance of Bolted Joints / Marcia B. H. Mantelli, M. R. Sridhar and M. M. Yovanovich
Optimum Design and Selection of Heat Sinks / Seri Lee
Achieving Accurate Thermal Characterization Using a CFD Code
A Case Study of PLCC Packages / Juan Burgos, Vincent P. Manno and Kaveh Azar
Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages (PQFP): A Computational Study / D. Pal and Y. Joshi
Methodology for Thermal Evaluation of Multichip Modules / Balwant S. Lall, Bruce M. Guenin and Ronald J. Molner
A Method of the BJT Transient Thermal Impedance Measurement with Double Junction Calibration / Janusz Zarebski and Krysztof Gorecki
A Method of Using Thermal Test Chips with Diodes for Thermal Characterization of Electronic Packages Without Calibration / H. Shaukatullah
Thermal Transient Characterization of Electronic Assemblies by Infrared Thermography and Delta Vbemeter Method / P. Dondon, E. Wolrgard and C. Zardini
A Measurement Methodology for Laser-based Thermal Diffusivity Measurement of Advanced Multichip Module Ceramic Material Systems / L. Kehoe, P. V. Kelly, G. M. O'Connor, M. O'Reilly and G. M. Crean
The Evolution of IBM High Performance Cooling Technology / Robert E. Simons
Experimental Investigation of Subcooled Liquid Nitrogen Impingement Cooling of a Silicon Chip / D. T. Vader, G. M. Chrysler, R. C. Chu and R. E. Simons
High Performance Air Cooling Scheme Using Ducted Microchannel Parallel Plate-FIN Heat Sinks / Michael B. Kleiner, Stefan A. Kuhn and Karl Haberger
Asymptotic Thermal Analysis of Electronic Packages and Printed Circuit Boards / Da-Guang Liu, V. Phanilatha, Qi-Jun Zhang and Michel N. Nakhla
Recent Advances in Thermal/Flow Simulation: Integrating Thermal Analysis into the Mechanical Design Process / J. Arnold Free, Richard Russell and Jeffery Louie
Analysis of a Thermally Enhanced Ball Grid Array Package / Bruce M. Guenin, Robert C. Marrs and Ronald J. Molnar.