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|a TK7871.85
|b .I27 1995
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| 082 |
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|a 621.38152
|b Ie2f, 1995
|2 20
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| 111 |
2 |
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|a IEEE Semiconductor Thermal Measurement and Management Symposium
|n (11th :
|d 1995 :
|c San José, Calif.)
|
| 245 |
1 |
0 |
|a Eleventh annual IEEE Semiconductor Thermal Measurement and Management Symposium :
|b February 7-9, 1995, Red Lion Hotel, San José, CA, USA.
|
| 246 |
1 |
4 |
|a 1995 IEEE 11th Annual Semiconductor Thermal Measurement & Management Symposium
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| 260 |
|
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|a Piscataway, NJ :
|b IEEE Service Center,
|c ©1995.
|
| 300 |
|
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|a x, 189 pages :
|b illustrations ;
|c 28 cm
|
| 336 |
|
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|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a unmediated
|b n
|2 rdamedia
|
| 338 |
|
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|a volume
|b nc
|2 rdacarrier
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| 504 |
|
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|a Includes bibliographical references.
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| 500 |
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|a "The Components, Packaging, & Manufacturing Technology (CPMT)--Society, Symposium sponsor."
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| 530 |
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|a Also available via the World Wide Web.
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| 505 |
0 |
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|a A Novel Approach For The Thermal Characterization of Electronic Parts / Clemens Lasance, Heinz Vinke, Harvey Rosten and Karl-Ludwig Weiner -- Thermal Characterization of Vertical Multichip Modules MCM-V / C. Cahill, T. Compagno, J. O. Donovan, O. Slattery, C. O'Mathuna, J. Barrett, I. Drouhin, C. Val, J. P. Tigneres, J. Stern, P. Ivey, M. Masgrangeas and A. Coello-Vera -- An Assessment of the Thermal Performance of the PBGA Family / Shailesh Mulgaonker, Ben Chambers and Mali Mahalingham -- Enhancement of Convective Cooling of Electronic Circuit Components / Cila Herman, Bhalchandra Puranik, Eric Kang and Sandor Szokolai -- Effect on Observed Package Thermal Performance of System Board Metal Content / David Billings and Roger Paul Stout -- A Study of Chip Thermal Crosstalk in Plastic VLSI Packages / David H. Chien and Chin C. Lee -- Influence of Elastic and Plastic Contact Models in the Overall Thermal Resistance of Bolted Joints / Marcia B. H. Mantelli, M. R. Sridhar and M. M. Yovanovich -- Optimum Design and Selection of Heat Sinks / Seri Lee -- Achieving Accurate Thermal Characterization Using a CFD Code -- A Case Study of PLCC Packages / Juan Burgos, Vincent P. Manno and Kaveh Azar -- Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages (PQFP): A Computational Study / D. Pal and Y. Joshi -- Methodology for Thermal Evaluation of Multichip Modules / Balwant S. Lall, Bruce M. Guenin and Ronald J. Molner -- A Method of the BJT Transient Thermal Impedance Measurement with Double Junction Calibration / Janusz Zarebski and Krysztof Gorecki -- A Method of Using Thermal Test Chips with Diodes for Thermal Characterization of Electronic Packages Without Calibration / H. Shaukatullah -- Thermal Transient Characterization of Electronic Assemblies by Infrared Thermography and Delta Vbemeter Method / P. Dondon, E. Wolrgard and C. Zardini -- A Measurement Methodology for Laser-based Thermal Diffusivity Measurement of Advanced Multichip Module Ceramic Material Systems / L. Kehoe, P. V. Kelly, G. M. O'Connor, M. O'Reilly and G. M. Crean -- The Evolution of IBM High Performance Cooling Technology / Robert E. Simons -- Experimental Investigation of Subcooled Liquid Nitrogen Impingement Cooling of a Silicon Chip / D. T. Vader, G. M. Chrysler, R. C. Chu and R. E. Simons -- High Performance Air Cooling Scheme Using Ducted Microchannel Parallel Plate-FIN Heat Sinks / Michael B. Kleiner, Stefan A. Kuhn and Karl Haberger -- Asymptotic Thermal Analysis of Electronic Packages and Printed Circuit Boards / Da-Guang Liu, V. Phanilatha, Qi-Jun Zhang and Michel N. Nakhla -- Recent Advances in Thermal/Flow Simulation: Integrating Thermal Analysis into the Mechanical Design Process / J. Arnold Free, Richard Russell and Jeffery Louie -- Analysis of a Thermally Enhanced Ball Grid Array Package / Bruce M. Guenin, Robert C. Marrs and Ronald J. Molnar.
|
| 650 |
|
0 |
|a Semiconductors
|x Thermal properties
|v Congresses.
|
| 650 |
|
0 |
|a Semiconductors
|x Cooling
|v Congresses.
|
| 650 |
|
6 |
|a Semi-conducteurs
|x Propriétés thermiques
|v Congrès.
|
| 650 |
|
6 |
|a Semi-conducteurs
|x Refroidissement
|v Congrès.
|
| 650 |
|
7 |
|a Semiconductors
|x Cooling
|2 fast
|
| 650 |
|
7 |
|a Semiconductors
|x Thermal properties
|2 fast
|
| 650 |
|
7 |
|a Semiconducteurs
|x Propriétés thermiques
|x Congrès.
|2 ram
|
| 655 |
|
7 |
|a Conference papers and proceedings
|2 fast
|
| 710 |
2 |
|
|a Components, Packaging & Manufacturing Technology Society.
|1 https://id.oclc.org/worldcat/entity/E39QH7JmpbhGgyjdbbxkJMgTTR
|
| 758 |
|
|
|i has work:
|a Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Text)
|1 https://id.oclc.org/worldcat/entity/E39PD3qHMkqBMtwjKVDbt4p3wC
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 856 |
4 |
1 |
|3 IEEE Xplore
|u http://ieeexplore.ieee.org/servlet/opac?punumber=3862
|t 0
|
| 856 |
4 |
1 |
|3 IEEE Xplore
|u http://www.ieeexplore.ieee.org/servlet/opac?punumber=3862
|t 0
|
| 938 |
|
|
|a Baker & Taylor
|b BKTY
|c 88.00
|d 92.95
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|n 0002729786
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|a YBP Library Services
|b YANK
|n 1480473
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| 948 |
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|h HELD BY TXA - 41 OTHER HOLDINGS
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| 994 |
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| 952 |
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|p ric
|a Texas A&M University
|b Rellis Campus
|c Joint Library Facility
|s JLF
|d Remote Storage
|t 0
|e TK7871.85 .I27 1995
|h Library of Congress classification
|i unmediated -- volume
|m A14819062448
|