http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
State University of New York at Binghamton
T.J. Watson School of Engineering, Applied Science, and Technology.
Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.
Includes bibliographical references and index.