Electronics packaging forum. Volume 1 /
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Van Nostrand Reinhold,
[1990]
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| Subjects: |
| Item Description: | Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology. |
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| Physical Description: | x, 347 pages : illustrations ; 24 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0442001789 (v. 1) |