rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    non sort: A
    title: numerical analysis of convective heat transfer in channels simulating electronic components
  name:
    name part: Kim. Sung Hoon.
    role:
      role term: creator
  name:
    name part: Anand, N. K.
    role:
      role term: degree supervisor.
  name:
    name part: Baskharone, E. A.
    role:
      role term: degree committee member.
  name:
    name part: Han, J. C.
    role:
      role term: degree committee member.
  name:
    name part: Holtzapple, M.
    role:
      role term: degree committee member.
  name:
    name part: Lau, S. C.
    role:
      role term: degree committee member.
  name:
    name part: Texas A & M University
    role:
      role term: degree granting institution.
  type of resource: text
  genre: bibliography
  genre: Academic theses.
  origin info:
    place:
      place term: xx
    date issued: 1993
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: xxi, 291 leaves : illustrations ; 28 cm
  abstract: The cooling performance of two dimensional channel flow simulating channels of electronic components has been studied numerically. A channel is formed with the substrates on which the heat sources are surface-mounted regularly in the stream - wise direction, and repeated identically in the transverse direction. The channel thus formed is coupled thermally with the neighboring channels via the substrates. Periodically fully developed flow (PDF) has been examined both for laminar and turbulent flow regimes. In addition, developing flow (DF) has been studied for laminar flow only to examine the entry effect. Both convection-only and conjugate conduction/convection modes of heat transfer are considered in the analysis. The control volume based finite difference method using SIMPLER algorithm is adapted for numerical calculations, incorporating a k-ε model. The results of DF and PDF are obtained independently and compared for flow and thermal fields in terms of module based temperatures. Calculations are made for a wide range of independent parameters such as Reynolds number (Re), conductivity ratio of the substrate to fluid (K[s]/ K[f]) and geometric factors. The results show that the assumption of constant temperature or heat flux is improper for block (heat source) or module surface. This is more pronounced for turbulent flow and blocks whose conductivities are low. The Nusselt number or overall thermal resistance (thermal performance) of a block in laminar PDF module is nearly independent of Re; however, there exists a minimum Re below which the thermal performance drastically deteriorates. This minimum Re exists between 100 and 500 depending on the geometric parameters. Thermal performance is enhanced with an increase in the substrate conductivity and continues up to a value of 10 for K[s]/K[f]. Any further increase of K[s]/ K[f] results in small or no improvement in the thermal performance because of the limitation of the cooling capacity of the channel. The same t…
  note: "Major subject: Mechanical Engineering."
  note: Vita.
  note: Ph. D. Texas A & M University 1993
  note: Includes bibliographical references.
  subject:
    topic: Heat equation
    topic: Numerical solutions
  subject:
    topic: Heat exchangers
  subject:
    topic: Heat
    topic: Transmission
  subject:
    topic: Major mechanical engineering
  identifier: http://gateway.proquest.com/openurl
  identifier: https://hdl.handle.net/1969.1/DISSERTATIONS-1474651
  identifier: http://proxy.library.tamu.edu/login
  related item:
    location:
      url: http://gateway.proquest.com/openurl
  related item:
    location:
      url: https://hdl.handle.net/1969.1/DISSERTATIONS-1474651
  related item:
    location:
      url: http://proxy.library.tamu.edu/login
  record info:
    record content source: TXA
    record creation date: 950410
    record change date: 20220103134907.0
    record identifier: in00001216630
    language of cataloging:
      language term: eng