Cover Image

Electronics packaging forum : multichip module technology issues /

Bibliographic Details
Other Authors: Morris, James E., 1944-
Format: Book
Language:English
Published: New York : IEEE Press, [1994]
Subjects:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.
Description
Physical Description:vii, 392 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and index.
ISBN:078030439X