Morris, J. E. (1994). Electronics packaging forum: Multichip module technology issues. IEEE Press.
Chicago Style (17th ed.) CitationMorris, James E. Electronics Packaging Forum: Multichip Module Technology Issues. New York: IEEE Press, 1994.
MLA (9th ed.) CitationMorris, James E. Electronics Packaging Forum: Multichip Module Technology Issues. IEEE Press, 1994.
Warning: These citations may not always be 100% accurate.