http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Materials in microelectronic and optoelectronic packaging
International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.)
International Ceramic Science and Technology Congress 1992 : San Francisco, Calif.)
viii, 471 pages : illustrations ; 24 cm.
edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla.
"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--Title page verso.
Includes bibliographical references and index.