http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Electrodeposition of Cu and Ag on Pd(111)
Atomic layers of Cu and Ag on single crystal Pd(111) electrode surfaces were prepared in H2SO4 and HCIO4 solutions under carefully controlled conditions and then characterized by electrochemical methods in parallel with two surface-sensitive electron spectroscopies, low energy electron diffraction (LEED) and Auger electron spectroscopy (AES). A particular effort was made in order to obtain quantitative measurements of Cu and Ag deposits for which there was evidence of good surface structure. These determinations were done in situ using three electrochemical techniques. Monolayer deposits of Cu when exposed to dilute iodide solutions produced a Pd(111)-([square root]3 x 5)-Cu,I LEED pattern. The iodine overlayer provided for the elegant control of the interfacial properties of the Cu-Pd surface. In vacuum, the iodine protected the Cu deposit from attack by oxygen, and in solution, it facilitated the electrochemical removal of the underlying Cu from the Pd(111) surface. The preparation of a Pd(111)-([square root]3 x [square root]3)R30°-I surface prevented the formation of surface oxides and thus allowed the selective deposition and removal of Ag.