http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Materials developments in microelectronic packaging
performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress
Electronic Materials and Processing Congress 1991 : Montréal, Québec)
Electronic Materials and Processing Division.
sponsored by the Electronic Materials and Processing Division of ASM International ; edited by Prabjit Singh.