I-THERM III : February 3-5, 1992, Four Seasons Hotel, Austin, TX, USA /

Bibliographic Details
Corporate Authors:	InterSociety Conference on Thermal Phenomena in Electronic Systems Austin, Texas, Institute of Electrical and Electronics Engineers, American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment, IEEE Components, Hybrids, and Manufacturing Technology Society. Technical Committee on Thermal Management
Format:	Conference Proceeding Book
Language:	English
Published:	New York, NY : Piscataway, NJ : Institute of Electrical and Electronics Engineers : Additional copies may be purchased from IEEE Service Center, c1992.
Subjects:	Electronic apparatus and appliances > Thermal properties > Congresses. Electronic apparatus and appliances > Thermal properties MODELS. COMPUTER SYSTEMS DESIGN. INTEGRATED CIRCUITS. THERMODYNAMICS. THERMAL EXPANSION. COMPUTER COMPONENTS. CHIPS (ELECTRONICS) HEAT TRANSFER. MICROELECTRONICS. ELECTRONIC EQUIPMENT. TEMPERATURE EFFECTS. CONFERENCES. COOLING SYSTEMS. COOLING. COMPUTERS. TRANSFORMERS. THERMODYNAMIC PROPERTIES. THERMAL STRESSES. PERIPHERAL EQUIPMENT (COMPUTERS) Conference papers and proceedings
Online Access:	IEEE Xplore IEEE Xplore

Description
Item Description:	Theme: "Thermal engineering in integrated design systems." Principal conference sponsor: IEEE Components, Hybrids, & Manufacturing Technology Society (CHMT) Technical committee on Thermal Management TC-9. "IEEE catalog number 92CH3096-5"--T.p. verso. Cover title : 1992 Intersociety Conference on Thermal Phenomena in Electronic Systems.
Physical Description:	xii, 292 p. : ill. ; 28 cm.
Bibliography:	Includes bibliographical references.
ISBN:	0780305035 9780780305038 0780305043 9780780305045 0780305051 9780780305052