Cover Image

Wafer scale integration, III : proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989 /

Bibliographic Details
Corporate Author: IFIP WG 10.5 Workshop on Wafer Scale Integration Como, Italy
Other Authors: Sami, Mariagiovanna, Distante, Fausto
Format: Conference Proceeding Book
Language:English
Published: Amsterdam ; New York : North-Holland ; 1990.
Subjects:
Integrated circuits > Wafer-scale integration > Congresses.
Description
Physical Description:ix, 402 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references.
ISBN:0444884963