Advanced electronic packaging materials : symposium held November 27-29, 1989, Boston, Massachusetts, U.S.A. /

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /
Published: (1997)

Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A. /
Published: (1989)

Electronic packaging materials science II : symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
Published: (1986)

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
Published: (1998)

Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. /
Published: (2005)

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /
Published: (2004)

Electronic packaging : materials and their properties /
Published: (1999)

Polymeric materials for electronics packaging and interconnection /
Published: (1989)

Materials for high-density electronic packaging and interconnection.
Published: (1990)

Thermal management materials for electronic packaging : preparation, characterization, and devices /
Published: (2024)

Advanced organics for electronic substrates and packages /
Published: (1992)

Advances in electronic packaging ; symposium record.
Published: (1967)

Advances in electronic circuit packaging.
Published: (1962)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2000)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2012)

Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Published: (1993)

Electronic packaging materials and their properties /
Published: (1999)

Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992 /
Published: (1992)

Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
Published: (1995)

Advances in electronic packaging, 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii /
Published: (2003)

Polymeric materials for electronics packaging and interconnection : developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988 /
Published: (1989)

Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published: (1994)

Advances in electronic packaging, 2001 : presented at the Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition : July 8-13, 2001, Kauai, Hawaii /
Published: (2001)

Advances in electronic circuit packaging ; proceedings /
Published: (1962)

Advances in electronic circuit packaging ; proceedings /
Published: (1965)

Advances in electronic circuit packaging ; proceedings /
Published: (1965)

Advances in electronic circuit packaging ; proceedings /
Published: (1963)

Advances in electronic circuit packaging ; proceedings /
Published: (1962)

Advances in electronic circuit packaging ; proceedings /
Published: (1964)

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii /
Published: (1999)

Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/AWSME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii /
Published: (1997)

Electronics packaging forum.
Published: (1990)

Electronic equipment packaging technology /
by: Ginsberg, Gerald L.
Published: (1992)

Electrical performance of electronic packaging.

Principles of electronic packaging /
Published: (1989)

New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /
Published: (1990)