Solder joint rework simulation analysis /

Bibliographic Details
Corporate Author:	Electronics Manufacturing Productivity Facility (U.S.)
Format:	Government Document Book
Language:	English
Published:	Ridgecrest, Calif. : The Facility, [1990]
Series:	EMPF TB ; 0019.
Subjects:	Solder and soldering.

Description
Item Description:	Shipping list number: 91-099-P.
Physical Description:	39 pages : illustrations (some color) ; 28 cm.
Bibliography:	Includes bibliographical references (page 9).