Multichip modules : systems advantages, major constructions, and materials technologies /

Bibliographic Details

Other Authors:	Johnson, R. Wayne, 1957-, Teng, Robert K. F., Balde, John W., 1923-
Format:	Book
Language:	English
Published:	New York : Institute of Electrical and Electronics Engineers, [1991]
Series:	IEEE Press selected reprint series
Subjects:	Electronic packaging. Microelectronic packaging.