International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts /

Bibliographic Details
Corporate Author:	International Symposium on Advances in Interconnection and Packaging Boston
Other Authors:	DeFonzo, Alfred P., Arjavalingham, Granallingham, Pazaris, James, Tewksbury, Stuart K., Carruthers, John R.
Format:	Conference Proceeding Book
Language:	English
Published:	Bellingham, Wa : SPIE, [1991]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 1389-1390.
Subjects:	Printed circuits > Congresses. Microelectronic packaging > Congresses.

Table of Contents:

Book one : Microelectronic interconnects and packages : optical and electrical technologies / Granallingham Arjavalingham and James Pazaris, editors.; Book two : Microelectronic interconnects and Packages : System and process integration / Stuart K. Tewksbury and John R. Carruthers, editors.