Cover Image

International Symposium on Advances in Interconnection and Packaging, 5-9 November 1990, Boston, Massachusetts /

Bibliographic Details
Corporate Author: International Symposium on Advances in Interconnection and Packaging Boston
Other Authors: DeFonzo, Alfred P., Arjavalingham, Granallingham, Pazaris, James, Tewksbury, Stuart K., Carruthers, John R.
Format: Conference Proceeding Book
Language:English
Published: Bellingham, Wa : SPIE, [1991]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 1389-1390.
Subjects:
Printed circuits > Congresses.
Microelectronic packaging > Congresses.
Description
Physical Description:2 volumes : illustrations ; 28 cm.
ISBN:081940456X