Cover Image

Advances in thermal modeling of electronic components and systems.

Bibliographic Details
Format: Serial
Language:English
Published: New York : Hemisphere Pub. Corp., [1988-]
Subjects:
Electronic apparatus and appliances > Temperature control > Mathematical models > Periodicals.
Heat > Transmission > Mathematical models > Periodicals.
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Description
Published:Vol. 1-
Item Description:"ASME Press series."
Published by: ASME Press, 1990-
Title from cover.
Description based on volume 2 (1990).
Imprint varies.
Physical Description:volumes ; 24 cm.
Publication Frequency:Irregular
ISSN:0897-7453