Cover Image

Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989 /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Winter Annual Meeting, American Society of Mechanical Engineers. Heat Transfer Division
Other Authors: Ortega, A., Agonafer, D.
Format: Book
Language:English
Published: New York, N.Y. : The Society, [1989]
Series:HTD (Series) ; vol. 121.
Subjects:
Electronic apparatus and appliances > Cooling > Congresses.
Heat > Convection > Congresses.

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