Cover Image

Proceedings : Second International Conference on Properties and Applications of Dielectric Materials, Beijing, China, September 12-16, 1988 /

Bibliographic Details
Corporate Authors: International Conference on Properties and Applications of Dielectric Materials Peking, China, Qing hua da xue (Beijing, China), IEEE Dielectrics and Electrical Insulation Society, Zhongguo dian gong ji shu xue hui. Dielectric Committee
Format: Conference Proceeding Book
Language:English
Published: New York, NY : IEEE, [1988]
Subjects:
Dielectrics > Congresses.
Description
Item Description:Spine title: 1988 IEEE International Conference on Properties and Applications of Dielectric Materials.
Errata slips inserted.
"88-CH2587-4."
Physical Description:2 volumes : illustrations ; 28 cm.
Bibliography:Includes bibliographies and index.