Cover Image

Symposium record.

Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium San Francisco, Western Electronic Show and Convention
Format: Conference Proceeding Book
Language:English
Published: [San Francisco], [publisher not identified] ; [1968]
Subjects:
Electronic apparatus and appliances > Packaging > Congresses.
Description
Item Description:Cover title.
"Presented at the 1968 Western Electronic Show and Convention."
Physical Description:1 volume (various pagings) : illustrations ; 28 cm.
Bibliography:Includes bibliographical references.