Advances in electronic packaging ; symposium record.

Bibliographic Details
Corporate Authors:	International Electronic Circuit Packaging Symposium San Francisco, Western Electronic Show and Convention
Format:	Conference Proceeding Book
Language:	English
Published:	[San Francisco], [publisher not identified] ; [1967]
Subjects:	Electronic apparatus and appliances > Packaging > Congresses.

Description
Item Description:	Cover title. "Presented at the 1967 Western Electronic Show and Convention."
Physical Description:	1 volume (various pagings) : illustrations ; 28 cm.
Bibliography:	Includes bibliographical references.