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Advances in electronic circuit packaging ; proceedings /

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Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium San Francisco, Western Electronic Show and Convention
Other Authors: Rosine, Lawrence L.
Format: Conference Proceeding Book
Language:English
Subjects:
Electronic apparatus and appliances > Packaging > Congresses.
Description
Item Description:"Sponsored by EDN ... [and] held concurrently with WESCON."
Physical Description:1 volume (various pagings) : illustrations ; 26 cm.
Bibliography:Includes bibliographical references.