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Advances in electronic circuit packaging ; proceedings /

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Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium Boulder, Colo., Colorado. University
Other Authors: Rosine, Lawrence L.
Format: Conference Proceeding Book
Language:English
Subjects:
Electronic apparatus and appliances > Packaging > Congresses.
Description
Item Description:"Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."
Physical Description:vi, 457 pages : illustrations ; 26 cm.
Bibliography:Includes bibliographical references.