International Electronic Circuit Packaging Symposium Boulder, Colo, Colorado. University, & Marrese, M. A. Advances in electronic circuit packaging: Proceedings.
Chicago Style (17th ed.) CitationInternational Electronic Circuit Packaging Symposium Boulder, Colo, Colorado. University, and Michael A. Marrese. Advances in Electronic Circuit Packaging: Proceedings.
MLA (9th ed.) CitationInternational Electronic Circuit Packaging Symposium Boulder, Colo, et al. Advances in Electronic Circuit Packaging: Proceedings.
Warning: These citations may not always be 100% accurate.